• DocumentCode
    3129643
  • Title

    The effects of CCL composition on signal loss for high frequency application

  • Author

    Liang, Peter

  • Author_Institution
    Electron. Mater. Div., NAN YA Plastic Corp., Taipei, Taiwan
  • fYear
    2009
  • fDate
    21-23 Oct. 2009
  • Firstpage
    236
  • Lastpage
    239
  • Abstract
    In the past, high-frequency communication applications put emphasis on low loss while high speed signal transmission is required to achieve the integrity of the signal. In order to ensure the target of low loss on the CCL materials, most studies focus on how to reduce the polarity for resin system to achieve low Dk and low tan ¿ to improve the signal characteristics of high-speed transmission. The recent rapid development of IT industry demand for high-frequency communications, coupled with many researches show the composition of the CCL material, such as copper foil, glass fiber yarn and resin modification. This study intends to analyze the roughness of copper foil matte side, glass type and spreading uniformity to realize the impact on high frequency signals. Finally, we hope we can find a low cost solution for high frequency communications applications.
  • Keywords
    dielectric losses; dielectric materials; permittivity; resins; signal processing; CCL composition; IT industry; copper foil matte side; glass type; high frequency application; high frequency signals; high speed signal transmission; high-frequency communications; high-speed transmission; resin system; signal characteristics; signal loss; spreading uniformity; Communication industry; Composite materials; Copper; Couplings; Frequency; Glass industry; Metals industry; Propagation losses; Resins; Textile industry;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-4341-3
  • Electronic_ISBN
    978-1-4244-4342-0
  • Type

    conf

  • DOI
    10.1109/IMPACT.2009.5382132
  • Filename
    5382132