Title :
Self-assembled out-of-plane high-Q integrated inductors
Author :
Van Schuylenbergh, K. ; Chua, C.L. ; Fork, D.K. ; Jeng-Ping Lu ; Griffiths, B.
Author_Institution :
Palo Alto Res. Center, CA, USA
Abstract :
Self-assembled high-quality (Q) factor, 3-D inductors were batch-fabricated. The out-of-plane geometry reduces eddy current and skin effect losses. Coils achieve Q-factors over 70 on both glass and 15-20 /spl Omega/-cm Si at 1 GHz. 3-D coil LC oscillators had 12.3 dB lower phase-noise versus spiral coils. Encapsulation affected neither phase noise nor Q-factor.
Keywords :
CMOS integrated circuits; Q-factor; eddy current losses; encapsulation; inductors; phase noise; radiofrequency integrated circuits; skin effect; 15 to 20 ohmcm; 3D inductors; CMOS; LC oscillators; Q-factors; RF front ends; coils; eddy current losses; encapsulation; out-of-plane high-Q integrated inductors; phase noise; skin effect losses; Coils; Eddy currents; Encapsulation; Geometry; Glass; Inductors; Oscillators; Q factor; Skin effect; Spirals;
Conference_Titel :
Electron Devices Meeting, 2002. IEDM '02. International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-7462-2
DOI :
10.1109/IEDM.2002.1175883
