• DocumentCode
    3129723
  • Title

    Retinal implant: bridging engineering and medicine

  • Author

    Wentai Liu

  • Author_Institution
    Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
  • fYear
    2002
  • fDate
    8-11 Dec. 2002
  • Firstpage
    492
  • Lastpage
    495
  • Abstract
    The development and technology challenges of a retinal prosthesis, from early through advanced generations, is presented, along with a characterization of the hurdles and breakthroughs encountered in the wide array of clinical and engineering disciplines which the project spans.
  • Keywords
    biomedical electrodes; biomedical electronics; biomedical telemetry; eye; packaging; prosthetics; sensors; system-on-chip; MARC prosthesis system; SOC; electrode array design; hermetic packaging; high-density microelectronics; multiple artificial retina chip set; retinal implant; retinal prosthesis; sensor integration; system on a chip; Acoustic signal processing; Array signal processing; Electrodes; Fabrication; Implants; Packaging; Pigmentation; Prosthetics; Retina; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2002. IEDM '02. International
  • Conference_Location
    San Francisco, CA, USA
  • Print_ISBN
    0-7803-7462-2
  • Type

    conf

  • DOI
    10.1109/IEDM.2002.1175887
  • Filename
    1175887