Title :
Retinal implant: bridging engineering and medicine
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Abstract :
The development and technology challenges of a retinal prosthesis, from early through advanced generations, is presented, along with a characterization of the hurdles and breakthroughs encountered in the wide array of clinical and engineering disciplines which the project spans.
Keywords :
biomedical electrodes; biomedical electronics; biomedical telemetry; eye; packaging; prosthetics; sensors; system-on-chip; MARC prosthesis system; SOC; electrode array design; hermetic packaging; high-density microelectronics; multiple artificial retina chip set; retinal implant; retinal prosthesis; sensor integration; system on a chip; Acoustic signal processing; Array signal processing; Electrodes; Fabrication; Implants; Packaging; Pigmentation; Prosthetics; Retina; Silicon;
Conference_Titel :
Electron Devices Meeting, 2002. IEDM '02. International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-7462-2
DOI :
10.1109/IEDM.2002.1175887
