• DocumentCode
    3129765
  • Title

    The stratified thermal modules for the LCD TV with LED backlight

  • Author

    Chiang, Song-Bor

  • Author_Institution
    Industrial Technology Research Institute, Energy and Environment Research Laboratories, China
  • fYear
    2009
  • fDate
    21-23 Oct. 2009
  • Firstpage
    207
  • Lastpage
    210
  • Abstract
    There are 180 LED lamps located at the LED panel for 85 W power consumption for the LED backlight. The LED lamps dissipate 68 W for heat. The 32¿ LCD TV geometry is 800 mm(L) * 500 mm(W) * 90 mm(H). There are six light-bars on the LED panel and 30 LEDs per bar. The single LED package emits red, green and blue. For fitting the LCD TV package case, the overall thermal module size is 700 mm(L)* 400 mm(W). In order to thin the LCD TV, the fins height is designed from 20 mm to 70 mm per 10 mm. Moreover, the fins length is set as 10 mm to 25 mm by every 5 mm. The thermal modules combine several types of fin under the natural convection. The thermal module multiplies the several fins types in one. Moreover, the stratified module is separated to upper and lower regions. The stratified thermal module provides higher fins for the upper region and induced supplied air-flow by the second opening. The results represent the upper region temperature is reduced from 68°C to 58°C obviously. The cold air-flow entrains the second opening and decreases the thermal and flow boundary effect. As the results, the temperature distribution of the whole thermal module obtains more uniform pattern by stratified design. So, the stratified thermal module enhances the temperature uniformity and increases that the air-flow passes through the tunnel of the fins.
  • Keywords
    LED displays; cooling; electronics packaging; heat sinks; liquid crystal displays; modules; television displays; LCD TV; LED backlight; LED package; power 85 W; size 32 in; size 400 mm; size 500 mm; size 700 mm; size 800 mm; size 90 mm; stratified thermal module; Light emitting diodes; TV;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-4341-3
  • Electronic_ISBN
    978-1-4244-4342-0
  • Type

    conf

  • DOI
    10.1109/IMPACT.2009.5382140
  • Filename
    5382140