DocumentCode :
3129881
Title :
Towards understanding degradation and breakdown of SiO2/high-k stacks
Author :
Kauerauf, T. ; Degraeve, R. ; Cartier, E. ; Govoreanu, B. ; Blomme, P. ; Kaczer, B. ; Pantisano, L. ; Kerber, A. ; Groeseneken, G.
Author_Institution :
IMEC, Leuven, Belgium
fYear :
2002
fDate :
8-11 Dec. 2002
Firstpage :
521
Lastpage :
524
Abstract :
To investigate the electrical properties and the reliability of high-k stacks, the leakage current and the time-dependent-dielectric-breakdown (TDDB) of SiO/sub 2//ZrO/sub 2/ double layers over a large thickness variation were measured. The strong asymmetry in leakage current for gate and substrate injection and the complicated determination of time-to-breakdown (t/sub BD/) especially for thin interfacial layers is explained. We show that for both polarities the interfacial layer determines the breakdown of the whole stack, but due to reduced leakage at low voltages the lifetime extrapolation models developed for single SiO/sub 2/ layers cannot be simply adopted.
Keywords :
dielectric thin films; leakage currents; permittivity; semiconductor device breakdown; semiconductor device reliability; semiconductor-insulator boundaries; silicon compounds; zirconium compounds; SiO/sub 2/-ZrO/sub 2/; SiO/sub 2//ZrO/sub 2/ double layers; SiO/sub 2//high-k stacks; electrical properties; gate injection; leakage current; reliability; substrate injection; thickness variation; thin interfacial layers; time-dependent dielectric breakdown; time-to-breakdown; Breakdown voltage; Current measurement; Degradation; Electric breakdown; Electric variables measurement; High K dielectric materials; High-K gate dielectrics; Leakage current; Low voltage; Thickness measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2002. IEDM '02. International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-7462-2
Type :
conf
DOI :
10.1109/IEDM.2002.1175894
Filename :
1175894
Link To Document :
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