DocumentCode
3129881
Title
Towards understanding degradation and breakdown of SiO2/high-k stacks
Author
Kauerauf, T. ; Degraeve, R. ; Cartier, E. ; Govoreanu, B. ; Blomme, P. ; Kaczer, B. ; Pantisano, L. ; Kerber, A. ; Groeseneken, G.
Author_Institution
IMEC, Leuven, Belgium
fYear
2002
fDate
8-11 Dec. 2002
Firstpage
521
Lastpage
524
Abstract
To investigate the electrical properties and the reliability of high-k stacks, the leakage current and the time-dependent-dielectric-breakdown (TDDB) of SiO/sub 2//ZrO/sub 2/ double layers over a large thickness variation were measured. The strong asymmetry in leakage current for gate and substrate injection and the complicated determination of time-to-breakdown (t/sub BD/) especially for thin interfacial layers is explained. We show that for both polarities the interfacial layer determines the breakdown of the whole stack, but due to reduced leakage at low voltages the lifetime extrapolation models developed for single SiO/sub 2/ layers cannot be simply adopted.
Keywords
dielectric thin films; leakage currents; permittivity; semiconductor device breakdown; semiconductor device reliability; semiconductor-insulator boundaries; silicon compounds; zirconium compounds; SiO/sub 2/-ZrO/sub 2/; SiO/sub 2//ZrO/sub 2/ double layers; SiO/sub 2//high-k stacks; electrical properties; gate injection; leakage current; reliability; substrate injection; thickness variation; thin interfacial layers; time-dependent dielectric breakdown; time-to-breakdown; Breakdown voltage; Current measurement; Degradation; Electric breakdown; Electric variables measurement; High K dielectric materials; High-K gate dielectrics; Leakage current; Low voltage; Thickness measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2002. IEDM '02. International
Conference_Location
San Francisco, CA, USA
Print_ISBN
0-7803-7462-2
Type
conf
DOI
10.1109/IEDM.2002.1175894
Filename
1175894
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