Stacking of known good rebuilt wafers without TSV applications to SiP /abandoned sensors

Miniaturisation for commercial applications demands very high interconnection densities and low costs. Wiser for former experiences, multi-chip modules, wafer scale integration, 3-D modules for Space, Defense and professional (3D Plus) applications, we learned that the yield constituted an important part of the production costs. The WDoD process allows to stack known good rebuilt wafer (KGRW) only. Several applications in the Medical and industrial domains have been presented. This extremely important densification of 10 to 20 levels per mm with only 100 ¿m around the largest die allows to launch extremely ambitious applications with memories, systems in package and abandoned sensors.