Session 5: Reliability & electro-migration

fYear

2009

fDate

21-23 Oct. 2009

Firstpage

153

Lastpage

153

Abstract

Start of the above-titled section of the conference proceedings record.

Keywords

Bonding; Electromigration; Infrared heating; Materials; Materials reliability; Microscopy; Reliability engineering;

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International

Conference_Location

Taipei

Print_ISBN

978-1-4244-4341-3

Type

conf

DOI

10.1109/IMPACT.2009.5382155

Filename

5382155

Link To Document