مرکز منطقه ای اطلاع رساني علوم و فناوري - Session 5: Reliability & electro-migration

DocumentCode :

3130080

Title :

Session 5: Reliability & electro-migration

fYear :

2009

fDate :

21-23 Oct. 2009

Firstpage :

153

Lastpage :

153

Abstract :

Start of the above-titled section of the conference proceedings record.

Keywords :

Bonding; Electromigration; Infrared heating; Materials; Materials reliability; Microscopy; Reliability engineering;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International

Conference_Location :

Taipei

Print_ISBN :

978-1-4244-4341-3

Type :

conf

DOI :

10.1109/IMPACT.2009.5382155

Filename :

5382155

Link To Document :