Title :
Microassembly Techniques for a Three-Dimensional Neural Stimulating Microelectrode Array
Author :
Yao, Y. ; Gulari, M.N. ; Wise, K.D.
Author_Institution :
Eng. Res. Center for Wireless Integrated Microsyst., Michigan Univ., Ann Arbor, MI
fDate :
Aug. 30 2006-Sept. 3 2006
Abstract :
This paper describes microassembly techniques for an out-of-plane three-dimensional microelectrode array for neural stimulating and recording in the central nervous system. An interlocking mechanism has been introduced into the microassembly components to facilitate the process, increase the robustness of the assembled device and improve the yield of the overall system. In-vivo testing has demonstrated full functionality of the microassembled 3D array
Keywords :
bioMEMS; biomedical electrodes; microassembling; microelectrodes; neurophysiology; MEMS; central nervous system; in-vivo testing; interlocking mechanism; microassembled 3D array; microassembly techniques; neural recording; neural stimulating microelectrode array; three-dimensional microelectrode array; Assembly systems; Bonding; Circuits; Gold; Microassembly; Microelectrodes; Micromechanical devices; Probes; Robustness; Silicon;
Conference_Titel :
Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
Conference_Location :
New York, NY
Print_ISBN :
1-4244-0032-5
Electronic_ISBN :
1557-170X
DOI :
10.1109/IEMBS.2006.260836
