• DocumentCode
    3130219
  • Title

    Advanced integrated passive device (IPD) low pass filter designs on WLCSP

  • Author

    Chang, Po-Hao ; Chiang, Kevin ; Lai, Yeng-Yuan ; Wang, Yu-Po

  • Author_Institution
    Siliconware Precision Ind. Co., Ltd., Taichung, Taiwan
  • fYear
    2009
  • fDate
    21-23 Oct. 2009
  • Firstpage
    132
  • Lastpage
    135
  • Abstract
    An integrated passive device (IPD) solution is one of the important implementation employing the advanced redistribution layers (RDL) technology to fabricate the design passive components. This paper would demonstrate DCS (GSM-1800) Band low pass filter design by using RDL technology. For the design requirement, the specification of insertion loss (EL) of LPF was required bigger than -0.8 dB, return loss (RL) was less than -20 dB, and the attenuations was smaller than -30 dB at two times and three times harmonic frequencies. For the circuit topology selection, in order to achieve a better electrical performance and gain a smaller pattern size, we consisted of five capacitors and two spiral inductors design to miniaturize and fabricate our prototypes. The measurement results were able to meet our demands and they were shown in below: Insertion Loss (EL): -0.8 dB, Return Loss (RL): -20 dB, Attenuation @ 2F0: < -30 dB, Attenuation @ 3F0: < -40 dB, and Pattern size is 1.6 x 0.5 mm . This paper successfully used RDL technology to demonstrate the IPD low pass filter and achieved miniaturization design for GSM-1800 (DCS) Band applications.
  • Keywords
    UHF filters; UHF integrated circuits; capacitors; inductors; low-pass filters; passive filters; radiotelephony; DCS; GSM-1800; WLCSP; advanced redistribution layer; integrated passive device; low pass filter; spiral inductors; Attenuation; Capacitors; Circuit topology; Distributed control; Frequency; Insertion loss; Integrated circuit technology; Low pass filters; Performance gain; Power harmonic filters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-4341-3
  • Electronic_ISBN
    978-1-4244-4342-0
  • Type

    conf

  • DOI
    10.1109/IMPACT.2009.5382162
  • Filename
    5382162