DocumentCode :
3130219
Title :
Advanced integrated passive device (IPD) low pass filter designs on WLCSP
Author :
Chang, Po-Hao ; Chiang, Kevin ; Lai, Yeng-Yuan ; Wang, Yu-Po
Author_Institution :
Siliconware Precision Ind. Co., Ltd., Taichung, Taiwan
fYear :
2009
fDate :
21-23 Oct. 2009
Firstpage :
132
Lastpage :
135
Abstract :
An integrated passive device (IPD) solution is one of the important implementation employing the advanced redistribution layers (RDL) technology to fabricate the design passive components. This paper would demonstrate DCS (GSM-1800) Band low pass filter design by using RDL technology. For the design requirement, the specification of insertion loss (EL) of LPF was required bigger than -0.8 dB, return loss (RL) was less than -20 dB, and the attenuations was smaller than -30 dB at two times and three times harmonic frequencies. For the circuit topology selection, in order to achieve a better electrical performance and gain a smaller pattern size, we consisted of five capacitors and two spiral inductors design to miniaturize and fabricate our prototypes. The measurement results were able to meet our demands and they were shown in below: Insertion Loss (EL): -0.8 dB, Return Loss (RL): -20 dB, Attenuation @ 2F0: < -30 dB, Attenuation @ 3F0: < -40 dB, and Pattern size is 1.6 x 0.5 mm . This paper successfully used RDL technology to demonstrate the IPD low pass filter and achieved miniaturization design for GSM-1800 (DCS) Band applications.
Keywords :
UHF filters; UHF integrated circuits; capacitors; inductors; low-pass filters; passive filters; radiotelephony; DCS; GSM-1800; WLCSP; advanced redistribution layer; integrated passive device; low pass filter; spiral inductors; Attenuation; Capacitors; Circuit topology; Distributed control; Frequency; Insertion loss; Integrated circuit technology; Low pass filters; Performance gain; Power harmonic filters;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4341-3
Electronic_ISBN :
978-1-4244-4342-0
Type :
conf
DOI :
10.1109/IMPACT.2009.5382162
Filename :
5382162
Link To Document :
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