مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

3130282

Title :

Session 4: SPIL session

fYear :

2009

fDate :

21-23 Oct. 2009

Firstpage :

116

Lastpage :

116

Abstract :

Start of the above-titled section of the conference proceedings record.

Keywords :

Copper; Design optimization; Flip chip; Metals industry; Micromachining; Packaging; Passive filters; Semiconductor films; Stress; Wide area networks;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International

Conference_Location :

Taipei

Print_ISBN :

978-1-4244-4341-3

Type :

conf

DOI :

10.1109/IMPACT.2009.5382165

Filename :

5382165

Link To Document :