Session 4: SPIL session

fYear

2009

fDate

21-23 Oct. 2009

Firstpage

116

Lastpage

116

Abstract

Start of the above-titled section of the conference proceedings record.

Keywords

Copper; Design optimization; Flip chip; Metals industry; Micromachining; Packaging; Passive filters; Semiconductor films; Stress; Wide area networks;

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International

Conference_Location

Taipei

Print_ISBN

978-1-4244-4341-3

Type

conf

DOI

10.1109/IMPACT.2009.5382165

Filename

5382165

Link To Document