• DocumentCode
    3130516
  • Title

    Issues in path toward low cost three-axis accelerometer for low-g application

  • Author

    Chen, Jen-Yi ; Liao, L.P. ; Chien, H.T. ; Lin, C.S. ; Hsu, Y.W.

  • Author_Institution
    Microsyst. Technol. Center, Ind. Technol. Res. Inst., Hsinchu, Taiwan
  • fYear
    2009
  • fDate
    21-23 Oct. 2009
  • Firstpage
    297
  • Lastpage
    300
  • Abstract
    The paper presents issues for an optimized three-axis accelerometer implementation. A VerilogA model was built for sensor design, the overall sensitivity, noise and frequency response are obtained by co-simulation with circuit tools. The critical parameters were optimized by theoretical calculation and fine tuned by finite-element-analysis (FEA) and integrated nodal simulation. Three spring-proof mass systems were integrated on a single structure in size of 1.3 × 1.28 mm2 for operating range of ±2g. A silicon-on-glass (SOG) process is adopted to achieve the high aspect-ratio structure, yielding excellent Z-axis sensitivity and resolution as high as 1.434 V/g and 49 ¿g/¿Hz. The sensitivity and minimum cross-axis sensitivity are 1.442 V/g and 0.03% for x-axis and are 1.241 V/g and 0.21% for y-axis. This optimized design demonstrates excellent performance satisfying the needs of consumer applications.
  • Keywords
    accelerometers; finite element analysis; hardware description languages; sensitivity analysis; FEA; VerilogA model; circuit tools; consumer applications; finite-element-analysis; frequency response; integrated nodal simulation; silicon-on-glass process; spring-proof mass systems; three-axis accelerometer; Accelerometers; Costs;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-4341-3
  • Electronic_ISBN
    978-1-4244-4342-0
  • Type

    conf

  • DOI
    10.1109/IMPACT.2009.5382175
  • Filename
    5382175