DocumentCode :
3130664
Title :
A low-g three-axis accelerometer IC
Author :
Hsu, Y.W. ; Lin, S.T. ; Lin, C.S. ; Liao, L.P. ; Chen, J.Y. ; Lin, S.J. ; Hsiao, C.L.
Author_Institution :
Micro Syst. Technol. Center, Ind. Technol. Res. Inst. (ITRI), Tainan, Taiwan
fYear :
2009
fDate :
21-23 Oct. 2009
Firstpage :
319
Lastpage :
322
Abstract :
This paper presents a three-axis, low-g accelerometer IC with analog and digital outputs for applications in consumer and mobile markets. This accelerometer is consisted of a sensing element chip and a digital IC, and is packed in a 3 mm × 5 mm × 0.9 mm LGA package. The sensing element integrates three spring-proof mass systems with self test electrodes on a single structure for sensing three-axis motion for operating range of ±5 g. The programmable resolution for digital output which offers user to adjust the resolution for different applications; and, nominally, the maximum resolution is as high as 16 Bits. The overall noise floors of the x-, y-, and z-axis are 408 ¿g/¿(Hz), 460 ¿g/¿(Hz), 238 ¿g/¿(Hz), respectively. From the characterization, this accelerometer IC demonstrates high cross-axis sensitivity immunity, high sensitivity, and good linearity for both in-plane and out-of-plane accelerometers that suggests this three-axis accelerometer to be potential for satisfying the needs of current applications to consumer and mobile market.
Keywords :
accelerometers; integrated circuit packaging; microsensors; accelerometer integrated circuit; cross-axis sensitivity immunity; digital output; land grid array; programmable resolution; size 0.9 mm; size 3 mm; size 5 mm; three spring-proof mass systems; Accelerometers; Analog integrated circuits; Application specific integrated circuits; Automatic testing; Digital integrated circuits; Electrodes; Integrated circuit noise; Integrated circuit packaging; Linearity; System testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4341-3
Electronic_ISBN :
978-1-4244-4342-0
Type :
conf
DOI :
10.1109/IMPACT.2009.5382181
Filename :
5382181
Link To Document :
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