• DocumentCode
    31307
  • Title

    Fabrication and Characterization of a Vacuum Encapsulated Curved Beam Switch for Harsh Environment Application

  • Author

    Bo Woon Soon ; Ng, Eldwin Jiaqiang ; Hong, Vu A. ; Yushi Yang ; Chae Hyuck Ahn ; You Qian ; Kenny, Thomas W. ; Chengkuo Lee

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore, Singapore
  • Volume
    23
  • Issue
    5
  • fYear
    2014
  • fDate
    Oct. 2014
  • Firstpage
    1121
  • Lastpage
    1130
  • Abstract
    A vacuum-encapsulated silicon switch with a curved electrode is characterized for operation in harsh environments. An ultraclean vacuum encapsulation process (episeal) seals the switch after release, providing a pristine operating environment for switching operations. In these devices, the curved beam of the actuator enhances the overdrive voltage tolerance to be more than 100 V. The ON/OFF cycle tests were carried out up to 105 cycles at room temperature, and at least 104 cycles under an elevated temperature of 300°C. Throughout the 300°C tests, an average contact resistance of ~ 28 kΩ is measured, demonstrating the stability of the contact. Finally, high speed pulse I-V monitoring unit was used to observe 13-μs switching speed.
  • Keywords
    contact resistance; electrodes; electrostatic devices; elemental semiconductors; encapsulation; microswitches; silicon; Si; contact resistance; curved electrode; episeal; harsh environment application; high speed pulse I-V monitoring unit; overdrive voltage tolerance; pristine operating environment; switching operations; temperature 300 C; time 13 mus; ultraclean vacuum encapsulation process; vacuum encapsulated curved beam switch; vacuum-encapsulated silicon switch; Contacts; Electrostatics; Force; Logic gates; Silicon; Structural beams; Switches; Rugged electronics; electrostatic switch; microelectromechanical systems (MEMS); relay; switch; switch.;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2014.2305754
  • Filename
    6766178