Title :
Development of Thermal spreading technology nowadays
Author :
Kang, Shung-Wen ; Tsai, Meng-Chang ; Weng, Ming-Tai ; Hsu, Chao-Hsiang
Author_Institution :
Dept. of Mech. & Electro-Mech. Eng., Tamkang Univ., Tamsui, Taiwan
Abstract :
Thermal spreading is a technology of decreasing the hot spot for electronic cooling and other high heat flux applications, and is characterized by high heat transfer, uniformity of heat removal. Vapor chamber is one of the Thermal spreading technologies which depend on two phase heat pipe technology. This paper provides an introduction to vapor chamber for electronic cooling, high power LEDs, multi heat sources, communication devices, and bio technology applications, reviews the development of thermal spreading technology nowadays, and summarizes the data regarding effects of vapor chamber inside thermal module, future applications, and suggestion. Some models of multi heat sources cooling were also presented.
Keywords :
cooling; heat pipes; thermal management (packaging); bio technology applications; communication devices; electronic cooling; high power LED; multi heat sources; thermal spreading technology; Electronics cooling; Heat transfer; Light emitting diodes;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4341-3
Electronic_ISBN :
978-1-4244-4342-0
DOI :
10.1109/IMPACT.2009.5382184
