Development of Thermal spreading technology nowadays

Author

Kang, Shung-Wen ; Tsai, Meng-Chang ; Weng, Ming-Tai ; Hsu, Chao-Hsiang

Author_Institution

Dept. of Mech. & Electro-Mech. Eng., Tamkang Univ., Tamsui, Taiwan

fYear

2009

fDate

21-23 Oct. 2009

Firstpage

328

Lastpage

335

Abstract

Thermal spreading is a technology of decreasing the hot spot for electronic cooling and other high heat flux applications, and is characterized by high heat transfer, uniformity of heat removal. Vapor chamber is one of the Thermal spreading technologies which depend on two phase heat pipe technology. This paper provides an introduction to vapor chamber for electronic cooling, high power LEDs, multi heat sources, communication devices, and bio technology applications, reviews the development of thermal spreading technology nowadays, and summarizes the data regarding effects of vapor chamber inside thermal module, future applications, and suggestion. Some models of multi heat sources cooling were also presented.

Keywords

cooling; heat pipes; thermal management (packaging); bio technology applications; communication devices; electronic cooling; high power LED; multi heat sources; thermal spreading technology; Electronics cooling; Heat transfer; Light emitting diodes;

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International

Conference_Location

Taipei

Print_ISBN

978-1-4244-4341-3

Electronic_ISBN

978-1-4244-4342-0

Type

conf

DOI

10.1109/IMPACT.2009.5382184

Filename

5382184