DocumentCode :
3130779
Title :
Investigation of the polymer wick structure applied to loop heat pipe
Author :
Wu, Shen-Chun ; Hsieh, Bing-Han ; Yeh, Chien-Chih ; Chen, Yau-Ming
Author_Institution :
Department of Mechatronic, Energy and Aerospace Engineering, Chung Cheng Institute of Technology, National Defense University, Taoyuan, Taiwan, R.O.C.
fYear :
2009
fDate :
21-23 Oct. 2009
Firstpage :
344
Lastpage :
347
Abstract :
The main purpose of this paper was to develop the manufacturing process and investigate the effects of various parameters of the polymer wicks in a loop heat pipe (LHP). In this study, Polystyrene was chosen as the material of the wick structure, and the salt-leaching method was applied to make the polymer wick structure which had properties of high porosity and low thermal conductivity. The pore radius and porosity of the polymer wick structures were controlled by changing the particle size and content of sodium chloride (NaCl). The polymer wick structures with different pore radius and porosity will be inserted into the LHP´s evaporator and be tested for their thermal performance. The results showed that the polymer wick structure with higher porosity and smaller pore radius not only improved the heat transfer capability but also reduced the thermal resistance. Under the allowable evaporator temperature of 85°C, the heat transfer capacity of the polymer wick with the porosity of 80% and pore size of 5.9µm can reach 320W and the thermal resistant was 0.234°C/W.
Keywords :
Conducting materials; Heat transfer; Manufacturing processes; Polymers; Resistance heating; Size control; Temperature; Testing; Thermal conductivity; Thermal resistance; Loop Heat Pipe; Polymer wick structure; Salt leaching Method;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei, Taiwan
Print_ISBN :
978-1-4244-4341-3
Electronic_ISBN :
978-1-4244-4342-0
Type :
conf
DOI :
10.1109/IMPACT.2009.5382187
Filename :
5382187
Link To Document :
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