DocumentCode
3130903
Title
Investigation of the polymer wick structure applied to loop heat pipe
Author
Wu, Shen-Chun ; Hsieh, Bing-Han ; Yeh, Chien-Chih ; Chen, Yau-Ming
Author_Institution
Dept. of Mechatron., Energy & Aerosp. Eng., Nat. Defense Univ., Taoyuan, Taiwan
fYear
2009
fDate
21-23 Oct. 2009
Firstpage
368
Lastpage
371
Abstract
The main purpose of this paper was to develop the manufacturing process and investigate the effects of various parameters of the polymer wicks in a loop heat pipe (LHP). In this study, Polystyrene was chosen as the material of the wick structure, and the salt-leaching method was applied to make the polymer wick structure which had properties of high porosity and low thermal conductivity. The pore radius and porosity of the polymer wick structures were controlled by changing the particle size and content of sodium chloride (NaCl). The polymer wick structures with different pore radius and porosity will be inserted into the LHP´s evaporator and be tested for their thermal performance. The results showed that the polymer wick structure with higher porosity and smaller pore radius not only improved the heat transfer capability but also reduced the thermal resistance. Under the allowable evaporator temperature of 85°C, the heat transfer capacity of the polymer wick with the porosity of 80% and pore size of 5.9¿m can reach 320W and the thermal resistant was 0.234°C/W.
Keywords
heat pipes; heat transfer; leaching; manufacturing processes; polymers; porosity; Polystyrene; heat transfer capacity; loop heat pipe; manufacturing process; polymer wick porosity; polymer wick structure; salt leaching method; size 5.9 mum; temperature 85 degC; Conducting materials; Heat transfer; Manufacturing processes; Polymers; Resistance heating; Size control; Temperature; Testing; Thermal conductivity; Thermal resistance; Loop Heat Pipe; Polymer wick structure; Salt leaching Method;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location
Taipei
Print_ISBN
978-1-4244-4341-3
Electronic_ISBN
978-1-4244-4342-0
Type
conf
DOI
10.1109/IMPACT.2009.5382194
Filename
5382194
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