• DocumentCode
    3130932
  • Title

    Quantitative assessment of slit mura defect in thin film transistor-liquid crystal display based on chromaticity and optical density

  • Author

    Tzu, Fu-Ming ; Chou, Jung-Hua

  • Author_Institution
    Dept. of Eng. Sci., Nat. Cheng Kung Univ., Tainan, Taiwan
  • fYear
    2009
  • fDate
    21-23 Oct. 2009
  • Firstpage
    373
  • Lastpage
    376
  • Abstract
    In this paper, we propose a creative non-contact automatic optical inspection (AOI) method for slit Mura measurements using a spectrometer and a photomultiplier tube (PMT). The experimental result indicate significant breakthrough of uniformity detection than typical macro CCD-based sensors and naked eyes, even the color difference is below the Just Noticeable Difference (JND) level. The characteristic of optical density (OD) is tended to be a concave curve; by contrast to chromaticity profile which shows a convex feature. Using the feature of chromaticity or optical density profiles across a slit Mura, the color difference from 0.12% to 2.71% in CIEy can be measured accurately. OD difference from 0.01 to 1.11 can be detected as well. Among of the samples, the most significant change is the 2.71% of CIEy chromatic variation versus a 1.1 OD difference along the slit Mura which is explored to quantity the JND´s perceptibility. A higher chromaticity corresponds to a higher transmittance and a lower optical density, and can be deduced accurately by the present method.
  • Keywords
    automatic optical inspection; liquid crystal displays; photomultipliers; spectrometers; thin film transistors; automatic optical inspection; chromaticity; optical density; photomultiplier tube; quantitative assessment; slit mura defect; spectrometer; thin film transistor-liquid crystal display; Automatic optical inspection; Density measurement; Displays; Eyes; Optical films; Optical sensors; Photomultipliers; Sensor phenomena and characterization; Spectroscopy; Thin film transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-4341-3
  • Electronic_ISBN
    978-1-4244-4342-0
  • Type

    conf

  • DOI
    10.1109/IMPACT.2009.5382196
  • Filename
    5382196