• DocumentCode
    3131003
  • Title

    Aftershock effects on the reliability of electronic components under shock test

  • Author

    Chen, Y.S. ; Huang, Yu-Chun

  • Author_Institution
    Dept. of Mech. Eng., Yuan Ze Univ., Chungli, Taiwan
  • fYear
    2009
  • fDate
    21-23 Oct. 2009
  • Firstpage
    385
  • Lastpage
    388
  • Abstract
    Shock test is one of the significant reliability tests for electronics products. JEDEC test standards regulate only the first controlled-pulse by defining a variety of conditions such as the pulse peak acceleration, pulse duration and velocity change during the drop impact processes. In reality, a practical test showed that not only was one pulse produced, but also a series of two or more aftershocks are encountered. Hence, it is doubtful on whether and how the aftershocks influence results of components´ reliability. The purpose of this study is to investigate the aftershocks´ effect on the test products and to predict the time interval of its occurrence as well as the relating acceleration responses. The investigations include experimental, theoretical and finite element analysis methods. The severity of aftershock and the time instant it happens were first tested and modeled precisely. This model was then used as input both for theoretical and numerical calculations to solve system´s response. Good consistencies among results of all three methods are observed, it is then possible to use the theoretical and FEA methods for the shock design of electronic systems prior to the manufacturing of the prototypes. Most importantly, the corresponding outcomes have taken the aftershock into consideration instead of only the primary pulse. It is believed to be more accurate in the reliability analysis of electronic products.
  • Keywords
    finite element analysis; impact testing; reliability; JEDEC test standards; aftershock effects; drop impact process; electronic component reliability; electronics products; finite element analysis; reliability tests; shock test; Electric shock; Electronic components; Electronic equipment testing; Aftershock; Finite Element (FE); Reliability; Shock; Shock Response Spectrum (SRS);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-4341-3
  • Electronic_ISBN
    978-1-4244-4342-0
  • Type

    conf

  • DOI
    10.1109/IMPACT.2009.5382198
  • Filename
    5382198