DocumentCode
3131104
Title
Session 14: Design, modeling & testing II
fYear
2009
fDate
21-23 Oct. 2009
Firstpage
406
Lastpage
406
Abstract
Start of the above-titled section of the conference proceedings record.
Keywords
Analytical models; Fatigue; Integrated circuit modeling; Integrated circuit packaging; Integrated circuit testing; Life testing; Space technology; Temperature; Thermal loading; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location
Taipei
Print_ISBN
978-1-4244-4341-3
Type
conf
DOI
10.1109/IMPACT.2009.5382203
Filename
5382203
Link To Document