مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

3131204

Title :

Session 15: Green materials & process I

fYear :

2009

fDate :

21-23 Oct. 2009

Firstpage :

431

Lastpage :

431

Abstract :

Start of the above-titled section of the conference proceedings record.

Keywords :

Copper; Corrosion; Environmentally friendly manufacturing techniques; Failure analysis; Lead; Shape control; Thin films; Wafer scale integration;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International

Conference_Location :

Taipei

Print_ISBN :

978-1-4244-4341-3

Type :

conf

DOI :

10.1109/IMPACT.2009.5382209

Filename :

5382209

Link To Document :