DocumentCode :
3131285
Title :
Electrochemical corrosion behavior of Pb-free solders for die attachment
Author :
Tsai, Chi-Hang ; Song, Jenn-Ming ; Fu, Yen-Pei
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Dong Hwa Univ., Hualien, Taiwan
fYear :
2009
fDate :
21-23 Oct. 2009
Firstpage :
448
Lastpage :
451
Abstract :
This study aimed to investigate the electrochemical corrosion behavior of the potential Pb-free solders, Bi-11 wt%Ag and Zn-40 wt%Sn, in 3.5% NaCl solution using the potentiodynamic polarization method with the scanning range from -2000 mV to +2000 mV. Pb-5 wt%Sn alloy was also examined for comparison. Experimental results show that the corrosion potential (Ecorr) decreased in the decreasing order was Bi-11Ag, Pb-5Sn, and Zn-40Sn. Zn-40Sn exhibited the highest current density (Icorr), and that for Pb-5Sn was the lowest. The Pb-5Sn samples had a much extended passive region compared to Bi-11Ag, while the Zn-40Sn samples showed no passive behavior within the scanning range. According to the XPS and XRD data, the corrosion products were main PbCl2 and PbO for Pb-5Sn, BiOCl, AgCl2, and Bi2O3 for Bi-11Ag. Zn rich phases (ZnO and ZnCl2) were found on the polarized surface of Zn-40Sn, and tin oxides were detected at the subsurface.
Keywords :
X-ray diffraction; X-ray photoelectron spectra; bismuth alloys; corrosion; current density; electrochemistry; microassembling; silver alloys; solders; tin alloys; zinc alloys; BiAg; Pb-free solders; XPS data; XRD data; ZnSn; corrosion potential; current density; die attachment; electrochemical corrosion behavior; potentiodynamic polarization method; Copper; Corrosion; Environmentally friendly manufacturing techniques; Failure analysis; Lead; Shape control; Thin films; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4341-3
Electronic_ISBN :
978-1-4244-4342-0
Type :
conf
DOI :
10.1109/IMPACT.2009.5382213
Filename :
5382213
Link To Document :
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