• DocumentCode
    3131310
  • Title

    Thermal management of liquid-cooled cold plates for multiple heat sources in a humanoid robot

  • Author

    Kim, Seo Young ; Hwang, Kyudae ; Moon, Jongmin ; Sarng Woo Karng

  • Author_Institution
    Energy Mech. Res. Center, Korea Inst. of Sci. Technol., Seoul, South Korea
  • fYear
    2009
  • fDate
    21-23 Oct. 2009
  • Firstpage
    453
  • Lastpage
    456
  • Abstract
    Thermal management for two array types of a serial circulation and a two-way parallel circulation using six mini liquid-cooled cold plates were experimentally measured in this study. In order to reduce weight of the cooling devices for humanoid robot cooling, the cold plates were covered with non-metallic material (polycarbonate, PC). Six cold plates attached on 10 × 10 mm2 copper base: 0.5 × 0.5 mm2 pin-finned surfaces of 1.5 mm high with 0.5 mm array spacing, was mounted on six copper heating blocks with isothermal conditions of 50~90°C, respectively. In order to compare thermal characteristics according to two circulation types, the surface temperatures of heating blocks and the cooling water temperatures at inlets and outlets of cold plates were measured. From the results, it was found that a two-way parallel circulation was better performance than a serial circulation in terms of total thermal resistance, total heat transfer rate, and surface temperature rises from first heating block to last one for six multiple cold plates.
  • Keywords
    cooling; humanoid robots; thermal resistance; cooling water temperatures; heat transfer rate; humanoid robot cooling; liquid-cooled cold plates; multiple heat sources; nonmetallic material; parallel circulation; polycarbonate; serial circulation; surface temperatures; temperature 50 degC to 90 degC; thermal management; thermal resistance; Cold plates; Cooling; Copper; Heat transfer; Humanoid robots; Resistance heating; Surface resistance; Temperature; Thermal management; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-4341-3
  • Electronic_ISBN
    978-1-4244-4342-0
  • Type

    conf

  • DOI
    10.1109/IMPACT.2009.5382215
  • Filename
    5382215