Title :
Preparation and characterization of nano-inorganic materials coated multi-walled carbon nanotubes/epoxy composites for thermal interface materials
Author :
Teng, Chih-Chun ; Ma, Chen-Chi M. ; Yang, Shin-Yi ; Huang, Yen-Wei ; Chiou, Kuo-Chan ; Lee, Tzong-Ming ; He, Wei-Syuan ; Jen-Chi Chuiang
Author_Institution :
Dept. of Chem. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Abstract :
Recent developments of nanofabrication have enabled the miniaturization of electronic devices, allowing more electronic devices to be combined into a single device with a high performance. However, the complex devices have led to the escalation of power dissipation as well as the increasing heat flux at the interface between devices. Electronic devices were damaged by much heat accumulation, since the reliability of devices is dependent on the junction temperature. For example a small operating temperature difference (in the order of 10~15°C) can result in a two times reduction in the lifetime of a device. Carbon nanotubes with large aspect ratio and unique thermal properties can be as thermal dissipating filler for some nanocomposites. However, carbon nanotubes with high electrical conductivity will induce short leakage at the same time. For overcoming this problem, the objective of this research is to propose the surface modification technology by inorganic materials on the carbon nanotubes for thermal interfacial materials (TIM) applications. This research is to develop the surface modification technology by depositing alumina nanoparticles on the surface of the multi-walled carbon nanotubes (MWCNTs). TIMs were prepared from epoxy resin and various content of alumina @ MWCNTs (1~5 phrs) and then their volume resistivity with different loading alumina @ MWCNTs content can maintain round 1015 ohm*cm. The thermal conductivity of a TIM with 5 phrs alumina @ MWCNTs was 1.01 W/mK (increased 677% compared to neat epoxy resin with 0.13 W/m*K).
Keywords :
carbon nanotubes; electrical conductivity; nanocomposites; nanofabrication; nanoparticles; reliability; Al2O3; C; alumina nanoparticles; electrical conductivity; electronic devices; epoxy composites; epoxy resin; multiwalled carbon nanotubes; nanocomposites; nanofabrication; nanoinorganic materials; reliability; surface modification technology; thermal dissipating filler; thermal interface materials; thermal interfacial materials; Carbon nanotubes; Cogeneration; Composite materials; Epoxy resins; Inorganic materials; Nanofabrication; Nanostructured materials; Organic materials; Power dissipation; Thermal conductivity;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4341-3
Electronic_ISBN :
978-1-4244-4342-0
DOI :
10.1109/IMPACT.2009.5382220