DocumentCode
3131460
Title
Base material consideration for high speed printed circuit boards
Author
Liu, Annie ; Liao, Eric
Author_Institution
Taiwan Union Technol. Corp., Chupei, Taiwan
fYear
2009
fDate
21-23 Oct. 2009
Firstpage
478
Lastpage
480
Abstract
To take our responsibility of reducing harm to our environment, EU RoHS restriction about lead-free capability is one of considered tasks for us to follow up. Additionally, the tendency shows that more and more demands of the higher signal transmission speed in various field of applications, and the demand of frequency shifts from 1-5 Gbps range to 5-10 Gbps depending on the applications. Recently the material improvement on lead-free process favored and better signal integrity performed laminate materials seems to be critical and sensitive to choose a moderate resin system. Considering the electrical, thermal performances and the cost effectiveness, we discuss the resulted performance from the point of view of laminate composition, such as resin, laminate construction, and some environment factors etc. combined with a massive mainstream application and low-loss application under the hypothesis of lead-free capability.
Keywords
laminates; printed circuit manufacture; resins; EU RoHS restriction; base material consideration; bit rate 1 Gbit/s to 10 Gbit/s; high speed printed circuit boards; laminate composition; lead-free process; moderate resin system; signal integrity; signal transmission speed; Printed circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location
Taipei
Print_ISBN
978-1-4244-4341-3
Electronic_ISBN
978-1-4244-4342-0
Type
conf
DOI
10.1109/IMPACT.2009.5382223
Filename
5382223
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