Time dependent deformation behavior of interfacial intermetallic compounds in electronic solder joints

Author

Song, Jenn-Ming ; Su, Chien-Wei ; Lai, Yi-Shao ; Chiu, Ying-Ta

Author_Institution

Dept. of Mater. Sci. & Eng., Nat. Dong Hwa Univ., Hailien, Taiwan

fYear

2009

fDate

21-23 Oct. 2009

Firstpage

497

Lastpage

500

Abstract

This study evaluated room temperature creep properties of the intermetallic compounds (IMCs) formed at the interfaces between Pb-free solders (Sn-Ag-Cu and Sn-Zn) and the commonly used electronic substrates (Cu, Ni and Ag) using nanoindentation. The creep stress exponent (CSE), representing creep resistance, in the decreasing order was Cu, Ni and then Ag based IMCs, which was in good agreement with tendencies of the work hardening exponent (n) and the ratio of yield stress (Y) to Young´s modulus (E) as well.

Keywords

Young´s modulus; copper alloys; creep fracture; creep testing; nanoindentation; silver alloys; solders; tin alloys; work hardening; yield stress; zinc alloys; Sn-Ag-Cu; Sn-Zn; Young´s modulus; creep resistance; creep stress exponent; electronic solder joints; electronic substrates; interfacial intermetallic compounds; nanoindentation; room temperature creep properties; time dependent deformation behavior; work hardening exponent; yield stress; Creep; Intermetallic; Joining materials; Materials reliability; Optical microscopy; Scanning electron microscopy; Soldering; Stress; Substrates; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International

Conference_Location

Taipei

Print_ISBN

978-1-4244-4341-3

Electronic_ISBN

978-1-4244-4342-0

Type

conf

DOI

10.1109/IMPACT.2009.5382227

Filename

5382227