Development of wafer probe testing method and femsimulation model

Prober testers have been widely used by the semiconductor industry to determine whether the individual Integrated Circuits (IC) meet specifications of design. In this paper, probe contact tests are developed with different testing overdrive distance by using a microforce tester. The probe tests are subsequently applied to a single tungsten needle probe to examine the relationships between contact force and scrub mark size on aluminum pads at various overdrive levels. A FE base simulation model was built and the simulation results were compared with testing output. The changing of the friction coefficient between pad and needle were studied, the results shown that it might be a key factor to control the scrubbing mark size.