• DocumentCode
    3131757
  • Title

    Using built-in self-test and adaptive recovery for defect tolerance in molecular electronics-based nanofabrics

  • Author

    Wang, Zhanglei ; Chakrabarty, Krishnendu

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC
  • fYear
    2005
  • fDate
    8-8 Nov. 2005
  • Lastpage
    486
  • Abstract
    We propose a built-in self-test (BIST) procedure for nanofabrics implemented using chemically-assembled electronic nanotechnology. Several fault detection configurations are presented to target stuck-at faults, shorts, opens, and connection faults in nanoblocks and switchblocks. We also present an adaptive recovery procedure through which we can identify defect-free nanoblocks and switchblocks in the nanofabric-under-test. The proposed BIST, recovery, and defect tolerance procedures are based on the reconfiguration of the nanofabric to achieve complete fault coverage for different types of faults. We show that a large fraction of defect-free blocks can be recovered using a small number of BIST configurations. We also present simple bounds on the recovery that can be achieved for a given defect density. Simulation results are presented for various nanofabric sizes, different defect densities, and for random and clustered defects. The proposed BIST procedure is well suited for regular and dense architectures that have high defect densities
  • Keywords
    built-in self test; fault tolerance; molecular electronics; nanoelectronics; adaptive recovery; built-in self-test; chemically-assembled electronic nanotechnology; connection faults; defect tolerance; fault detection configurations; molecular electronics-based nanofabrics; nanoblocks; stuck-at faults; switchblocks; Built-in self-test; CMOS technology; Chemical technology; Circuit faults; Costs; Economic forecasting; Manufacturing; Nanotechnology; Power generation economics; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2005. Proceedings. ITC 2005. IEEE International
  • Conference_Location
    Austin, TX
  • Print_ISBN
    0-7803-9038-5
  • Type

    conf

  • DOI
    10.1109/TEST.2005.1584008
  • Filename
    1584008