Title :
Test implications of lead-free implementation in a high-volume manufacturing environment
Author :
Peng, Shu ; Sam Wong
Author_Institution :
Celestica Technol. Co. Ltd., Suzhou
Abstract :
This paper attempts to: (a) examine the defect spectrum between lead free and tin lead PCBA in a volume production environment; and (b) identify any test and inspection needs, such as the AXI, in relation to lead free testing. This information assists the PCBA manufacturer when transitioning to a lead free environment
Keywords :
assembling; inspection; printed circuit manufacture; printed circuit testing; automatic X-ray inspection; defect spectrum; high-volume manufacturing environment; lead free environment; lead free testing; printed circuit board assembly; tin lead; volume production environment; Automatic testing; Circuit testing; Environmentally friendly manufacturing techniques; Inspection; Lead; Ovens; Packaging; Surface-mount technology; Test equipment; Tin;
Conference_Titel :
Test Conference, 2005. Proceedings. ITC 2005. IEEE International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-9038-5
DOI :
10.1109/TEST.2005.1584023
