DocumentCode
3132032
Title
Test implications of lead-free implementation in a high-volume manufacturing environment
Author
Peng, Shu ; Sam Wong
Author_Institution
Celestica Technol. Co. Ltd., Suzhou
fYear
2005
fDate
8-8 Nov. 2005
Lastpage
627
Abstract
This paper attempts to: (a) examine the defect spectrum between lead free and tin lead PCBA in a volume production environment; and (b) identify any test and inspection needs, such as the AXI, in relation to lead free testing. This information assists the PCBA manufacturer when transitioning to a lead free environment
Keywords
assembling; inspection; printed circuit manufacture; printed circuit testing; automatic X-ray inspection; defect spectrum; high-volume manufacturing environment; lead free environment; lead free testing; printed circuit board assembly; tin lead; volume production environment; Automatic testing; Circuit testing; Environmentally friendly manufacturing techniques; Inspection; Lead; Ovens; Packaging; Surface-mount technology; Test equipment; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2005. Proceedings. ITC 2005. IEEE International
Conference_Location
Austin, TX
Print_ISBN
0-7803-9038-5
Type
conf
DOI
10.1109/TEST.2005.1584023
Filename
1584023
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