DocumentCode :
3132040
Title :
Session 22: Green materials & assembly II
fYear :
2009
fDate :
21-23 Oct. 2009
Firstpage :
593
Lastpage :
593
Abstract :
Start of the above-titled section of the conference proceedings record.
Keywords :
Assembly;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4341-3
Type :
conf
DOI :
10.1109/IMPACT.2009.5382254
Filename :
5382254
Link To Document :
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