Title :
Bead probes in practice
Author :
Parker, Kenneth P.
Author_Institution :
Agilent Technol., Loveland, CO
Abstract :
Bead probes, a technology for in-circuit test probing of high-speed and/or high-density printed circuit boards was introduced at the 2004 International Test Conference as stated in K. P. Parker (2004). Since then much experimentation has been done with bead probe technology, and a large, high-density board has been designed and produced that makes use of them. This paper discusses the learning from these efforts
Keywords :
printed circuit testing; probes; test equipment; bead probes; high density printed circuit boards; in-circuit test; Circuit testing; Copper; Fixtures; Gravity; Manufacturing; Pins; Printed circuits; Probes; Shape; Surface tension;
Conference_Titel :
Test Conference, 2005. Proceedings. ITC 2005. IEEE International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-9038-5
DOI :
10.1109/TEST.2005.1584024
