DocumentCode :
3132057
Title :
iNEMI HFR-free leadership program
Author :
Tisdale, Stephen ; Pfahl, Robert C. ; Fu, Haley
Author_Institution :
Int. Electron. Manuf. Initiative (iNEMI), Herndon, VA, USA
fYear :
2009
fDate :
21-23 Oct. 2009
Firstpage :
594
Lastpage :
597
Abstract :
The electronics industry is aggressively pursuing the removal of potentially toxic compounds from their products, including the halogenated flame retardants (HFRs) that were once widely used in electronics housings and cases and are still used extensively in printed circuit boards. Several leading electronics companies have publicly stated their intent to remove brominated and/or halogenated flame retardants from some or all of their products. The International Electronics Manufacturing Initiative (iNEMI), an industry-led consortium, is working with a number of its OEM and supply chain members to assess the feasibility of a broad conversion to HFR-free PCB materials. While IPC and JEDEC are developing halogen-free standard specifications and numerous companies have compliant materials, significant questions remain regarding overall readiness to make a transition to these materials. This paper will discuss results & conclusions from the completed iNEMI HFR-free PCB Materials Project, as well as outline current projects, which include the HFRfree High-Reliability PCB project, the HFR-free Signal Integrity Project and the HFR-free PCB Material Development Project.
Keywords :
RoHS compliance; electronics industry; flame retardants; hazardous materials; printed circuit manufacture; HFR-free PCB Material Development Project; HFR-free PCB materials; HFR-free Signal Integrity Project; HFRfree High-Reliability PCB project; IPC; International Electronics Manufacturing Initiative; JEDEC; brominated flame retardants; compliant materials; electronics cases; electronics companies; electronics housings; electronics industry; halogen-free standard specifications; halogenated flame retardants; iNEMI HFR-free PCB Materials Project; iNEMI HFR-free leadership program; potentially toxic compounds; printed circuit boards; Electronics industry; Flame retardants; IEC standards; Industrial electronics; Laminates; Manufacturing; Plastics; Printed circuits; Resins; Supply chains;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4341-3
Electronic_ISBN :
978-1-4244-4342-0
Type :
conf
DOI :
10.1109/IMPACT.2009.5382255
Filename :
5382255
Link To Document :
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