On extensive pump handling of chemical-mechanical polishing slurries

Author

Singh, Rakesh K. ; Roberts, Benjamin R.

Author_Institution

Chem. Manage. Div., BOC Edwards, Santa Clara, CA, USA

fYear

2001

fDate

2001

Firstpage

107

Lastpage

113

Abstract

The effects of extensive pump handling on chemical-mechanical polishing (CMP) slurries have been investigated in this study. A number of common CMP slurries were recirculated in bellows pump loops. Large particle counts (LPC) and particle size distributions (PSDs) were generated using commercially available instruments. The PSDs of oxide CMP slurries illustrate distinct, developing characteristics as a result of repeated shearing during handling. Unlike most silica oxide slurries, alumina- and ceria-based slurries do not seem to generate large particles due to pump handling over extended periods of time. Some of these slurries show a decrease in number of large particles or soft flakes in pump recirculation tests. The PSD and LPC data for an oxide slurry handling test in a vacuum-pressure-dispense-technology-based pump show generation of fewer large particles as compared to a bellows pump. This study also demonstrates that insignificant progressive settling of abrasive particles takes place inside the pump or in the pump loop during handling of quick-settling CMP slurries

Keywords

abrasion; chemical mechanical polishing; dielectric thin films; integrated circuit metallisation; integrated circuit testing; materials handling; particle size; pumps; surface contamination; Al₂O₃; CMP slurries; CMP slurry recirculation; CeO₂; PSDs; SiO₂; abrasive particles; alumina-based slurries; bellows pump; bellows pump loops; ceria-based slurries; chemical-mechanical polishing slurries; extensive pump handling; handling; large particle counts; oxide CMP slurries; oxide slurry handling test; particle generation; particle size distributions; pump handling; pump handling effects; pump loop; pump recirculation tests; quick-settling CMP slurries; repeated shearing; silica oxide slurries; soft flakes; vacuum-pressure-dispense-technology-based pump; Bellows; Chemicals; Inorganic materials; Linear predictive coding; Shearing; Silicon compounds; Slurries; Solids; Testing; Vacuum systems;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing Conference, 2001 IEEE/SEMI

Conference_Location

Munich

ISSN

1078-8743

Print_ISBN

0-7803-6555-0

Type

conf

DOI

10.1109/ASMC.2001.925627

Filename

925627