Title :
Proceedings of the 1999 7th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.99TH8394)
Abstract :
The following topics were dealt with: failure analysis techniques; device processing; packaging and metallization; dielectric materials; hot carriers; EOS/ESD and latchup; physical analysis and device reliability
Keywords :
failure analysis; integrated circuit reliability; EOS; ESD; device processing; device reliability; dielectric material; failure analysis; hot carriers; integrated circuit; latchup; metallization; packaging; physical analysis;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 1999. Proceedings of the 1999 7th International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
0-7803-5187-8
DOI :
10.1109/IPFA.1999.791188
