Title :
Thickness and density measurement for new materials with combined X-ray technique
Author :
Terada, Shinichi ; Murakami, Hiroyuki ; Nishihagi, Kazuo
Author_Institution :
TECHNOS Co. Ltd., Hirakata, Japan
Abstract :
An X-ray metrology tool with functions of X-ray reflectometry (XRR), X-ray fluorescence (XRF) and X-ray diffraction (XRD) has been developed. Film thicknesses can be determined using XRR, XRF or XRD. Method selection criteria are discussed here. Film density is determined using XRR, film composition is determined using XRF, and crystal orientation is determined using XRD. Combined tools are developed to give maximum speed for major IC metrology applications
Keywords :
X-ray apparatus; X-ray diffraction; X-ray fluorescence analysis; X-ray reflection; crystal orientation; density measurement; integrated circuit interconnections; integrated circuit measurement; integrated circuit metallisation; nondestructive testing; reflectometry; thickness measurement; IC metrology applications; X-ray diffraction; X-ray fluorescence; X-ray metrology tool; X-ray reflectometry; XRD; XRF; XRR; combined X-ray technique; crystal orientation; density measurement; film composition; film density; film thickness; thickness measurement; Crystalline materials; Crystallization; Density measurement; Equations; Optical films; Optical sensors; Pollution measurement; Semiconductor films; Thickness measurement; X-ray scattering;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference, 2001 IEEE/SEMI
Conference_Location :
Munich
Print_ISBN :
0-7803-6555-0
DOI :
10.1109/ASMC.2001.925630
