Title :
InAsP/InGaP all ternary strain-compensated multiple quantum wells and its application to long wavelength lasers
Author :
Yokouchi, N. ; Yamanaka, N. ; Iwai, N. ; Matsuda, T. ; Kasukawa, A.
Author_Institution :
R&D Labs., Furukawa Electr. Co. Ltd., Yokohama, Japan
Abstract :
By newly introducing InGaP tensile strained layer as barriers of InAsP compressively strained multiple quantum wells, a high crystalline quality of InAsP/InGaP strain-compensated multiple quantum wells was obtained using metalorganic chemical vapor deposition on (100) InP substrate. Strain compensation was clearly confirmed by the surface morphology, double crystal X-ray measurement and photoluminescence spectrum. A first laser consisting of an all ternary quantum well active layer was successfully fabricated. The threshold current density of 1 kA/cm2 was obtained, cavity length of 600 μm, without the use of a separate confinement heterostructure layer. A very low threshold current density of 300 A/cm2 was achieved in an improved structure emitting at 1.3 μm
Keywords :
III-V semiconductors; X-ray diffraction; current density; gallium compounds; indium compounds; laser transitions; photoluminescence; quantum well lasers; semiconductor growth; surface structure; vapour phase epitaxial growth; (100) InP substrate; 1.3 mum; 600 mum; InAsP compressively strained multiple quantum wells; InAsP-InGaP; InAsP/InGaP all ternary strain-compensated multiple quantum wells; InGaP tensile strained layer; InP; barriers; cavity length; double crystal X-ray measurement; high crystalline quality; long wavelength lasers; metalorganic chemical vapor deposition; photoluminescence spectrum; strain compensation; surface morphology; threshold current density; Chemical lasers; Chemical vapor deposition; Crystallization; Indium phosphide; Photoluminescence; Quantum well lasers; Strain measurement; Surface emitting lasers; Surface morphology; Threshold current;
Conference_Titel :
Indium Phosphide and Related Materials, 1995. Conference Proceedings., Seventh International Conference on
Conference_Location :
Hokkaido
Print_ISBN :
0-7803-2147-2
DOI :
10.1109/ICIPRM.1995.522075