DocumentCode :
3132261
Title :
Semiconductor component qualification
Author :
Wu, Mei-Ling ; Pecht, Michael
Author_Institution :
Dept. of Mech. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
fYear :
2009
fDate :
21-23 Oct. 2009
Firstpage :
644
Lastpage :
647
Abstract :
Semiconductor component manufacturers supply to different products in a wide range of market segments, and therefore the end use conditions may not always be known. Qualifying a semiconductor component or demonstrating that it can operate reliably under use conditions can therefore be a challenging task. The goal of this paper is to describe the challenges in semiconductor component qualification and demonstrate how use conditions and product configuration can influence reliability and therefore qualification test selection. Industry practices on component qualification are summarized and an ideal component qualification plan that takes into account end use conditions and product configuration is described.
Keywords :
semiconductor device manufacture; product configuration; qualification test selection; semiconductor component qualification; use conditions; Qualifications;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4341-3
Electronic_ISBN :
978-1-4244-4342-0
Type :
conf
DOI :
10.1109/IMPACT.2009.5382267
Filename :
5382267
Link To Document :
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