DocumentCode
3132287
Title
Thermal and electrical transients during ESD stress
Author
Dave, Suresh
fYear
1988
fDate
16-19 May 1988
Abstract
A novel approach is presented for predicting the harmful temperatures and voltage present during electrostatic-discharge (ESD) stress. The analytical model based on a thermal equivalent circuit, predicts a maximum temperature as a function of process and design variables. Damaging electrical voltages are predicted in a similar manner. A viable ESD design methodology evolves out of the above models, and an outline of such a methodology is discussed. Further work needed towards the design of practical ESD protection circuits is examined
Keywords
discharges (electric); electrostatics; equivalent circuits; analytical model; design methodology; electrical transients; maximum temperature; thermal equivalent circuit; Analytical models; Circuits; Design methodology; Diodes; Electrostatic discharge; Process design; Protection; Temperature; Thermal stresses; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Custom Integrated Circuits Conference, 1988., Proceedings of the IEEE 1988
Conference_Location
Rochester, NY
Type
conf
DOI
10.1109/CICC.1988.20944
Filename
20944
Link To Document