Title :
Thermal and electrical transients during ESD stress
Abstract :
A novel approach is presented for predicting the harmful temperatures and voltage present during electrostatic-discharge (ESD) stress. The analytical model based on a thermal equivalent circuit, predicts a maximum temperature as a function of process and design variables. Damaging electrical voltages are predicted in a similar manner. A viable ESD design methodology evolves out of the above models, and an outline of such a methodology is discussed. Further work needed towards the design of practical ESD protection circuits is examined
Keywords :
discharges (electric); electrostatics; equivalent circuits; analytical model; design methodology; electrical transients; maximum temperature; thermal equivalent circuit; Analytical models; Circuits; Design methodology; Diodes; Electrostatic discharge; Process design; Protection; Temperature; Thermal stresses; Voltage;
Conference_Titel :
Custom Integrated Circuits Conference, 1988., Proceedings of the IEEE 1988
Conference_Location :
Rochester, NY
DOI :
10.1109/CICC.1988.20944