DocumentCode
3132339
Title
Influence of plastic assembly yield with molding technology
Author
Wang, Mu-Chun ; Huang, Kuo-Shu ; Hsieh, Zhen-Ying ; Yang, Hsiang-Lin ; Chen, Shuang-Yuan ; Fan, Shou-Kong
Author_Institution
Dept. & Inst. of Electron. Eng., Ming-Hsin Univ. of Sci. & Technol., Hsinchu, Taiwan
fYear
2009
fDate
21-23 Oct. 2009
Firstpage
652
Lastpage
655
Abstract
The molding technology in IC assembly is to protect the ICs avoiding the external damage and indirectly provide the heat dissipation. The molding pattern design, transfer-mold system, providing the drawing pipeline for liquid molding compound in molding is not only the technical index, but the key in the assembly throughput. Furthermore, the integrity of molding compound in plastic assembly is the main role of assembly quality. Analyzing these two factors impacting the assembly performance is the chief investigation in this work.
Keywords
cooling; integrated circuit packaging; integrated circuit yield; moulding; heat dissipation; integrated circuit assembly; molding technology; plastic assembly yield; transfer-mold system; Assembly; Plastics;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location
Taipei
Print_ISBN
978-1-4244-4341-3
Electronic_ISBN
978-1-4244-4342-0
Type
conf
DOI
10.1109/IMPACT.2009.5382270
Filename
5382270
Link To Document