Title :
Influence of plastic assembly yield with molding technology
Author :
Wang, Mu-Chun ; Huang, Kuo-Shu ; Hsieh, Zhen-Ying ; Yang, Hsiang-Lin ; Chen, Shuang-Yuan ; Fan, Shou-Kong
Author_Institution :
Dept. & Inst. of Electron. Eng., Ming-Hsin Univ. of Sci. & Technol., Hsinchu, Taiwan
Abstract :
The molding technology in IC assembly is to protect the ICs avoiding the external damage and indirectly provide the heat dissipation. The molding pattern design, transfer-mold system, providing the drawing pipeline for liquid molding compound in molding is not only the technical index, but the key in the assembly throughput. Furthermore, the integrity of molding compound in plastic assembly is the main role of assembly quality. Analyzing these two factors impacting the assembly performance is the chief investigation in this work.
Keywords :
cooling; integrated circuit packaging; integrated circuit yield; moulding; heat dissipation; integrated circuit assembly; molding technology; plastic assembly yield; transfer-mold system; Assembly; Plastics;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4341-3
Electronic_ISBN :
978-1-4244-4342-0
DOI :
10.1109/IMPACT.2009.5382270
