DocumentCode
3132385
Title
Experimental Validation of a Multi-scale Free-space Intra-chip Optical Interconnection Fabric Concept
Author
Gu, Tian ; Iqbal, Muzammil ; McFadden, Michael J. ; Haney, Michael W.
Author_Institution
Dept. of Electr. & Comput. Eng., Delaware Univ., Newark, DE
fYear
2006
fDate
Oct. 2006
Firstpage
813
Lastpage
814
Abstract
In this paper, key aspects of a 3-D optoelectronic application specific interconnection fabric system are demonstrated. The approach uses an array of high-density, precisely oriented micro-prisms that are lithographically fabricated to affect an arbitrary global interconnection fabric
Keywords
application specific integrated circuits; integrated optoelectronics; micro-optics; optical fabrication; optical interconnections; optical prisms; photolithography; 3-D optoelectronic application specific interconnection fabric system; gray-scale lithography; micro-prism fabrication; multiscale free-space intra-chip optical interconnection; Bandwidth; Fabrics; Integrated circuit interconnections; Lenses; Microoptics; Optical filters; Optical interconnections; Optical receivers; Silicon; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society, 2006. LEOS 2006. 19th Annual Meeting of the IEEE
Conference_Location
Montreal, Que.
Print_ISBN
0-7803-9555-7
Electronic_ISBN
0-7803-9555-7
Type
conf
DOI
10.1109/LEOS.2006.279036
Filename
4054434
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