Using a pattern monitor wafer on an inspection tool for chamber recoveries

Author

Audette, Danny ; Triplett, Michael

Author_Institution

IBM Corp., Essex Junction, VT, USA

fYear

2001

fDate

2001

Firstpage

237

Lastpage

239

Abstract

In the past, when a maintenance person wanted to recover a process chamber from either an FM issue or a wet strip, they would use a bare silicon wafer. This worked when line sizes were larger. Current technology has a need for better process chamber controls. Pattern monitors look to be the future in tool recovery for lowering defect density. The use of classification and failure analysis on pattern monitors gives us the ability to identify and locate smaller particles that would have never been found in the past

Keywords

failure analysis; inspection; integrated circuit testing; integrated circuit yield; maintenance engineering; pattern classification; process monitoring; production testing; surface contamination; FM issue; bare silicon wafer; chamber recoveries; defect density; failure analysis; inspection tool; line size; maintenance; particle size; pattern monitor classification; pattern monitor wafer; pattern monitors; process chamber controls; process chamber recovery; tool recovery; wet strip; Condition monitoring; Failure analysis; Floppy disks; Inspection; Microelectronics; Process control; Rivers; Semiconductor device manufacture; Silicon; Strips;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing Conference, 2001 IEEE/SEMI

Conference_Location

Munich

ISSN

1078-8743

Print_ISBN

0-7803-6555-0

Type

conf

DOI

10.1109/ASMC.2001.925653

Filename

925653