Title :
Using a pattern monitor wafer on an inspection tool for chamber recoveries
Author :
Audette, Danny ; Triplett, Michael
Author_Institution :
IBM Corp., Essex Junction, VT, USA
Abstract :
In the past, when a maintenance person wanted to recover a process chamber from either an FM issue or a wet strip, they would use a bare silicon wafer. This worked when line sizes were larger. Current technology has a need for better process chamber controls. Pattern monitors look to be the future in tool recovery for lowering defect density. The use of classification and failure analysis on pattern monitors gives us the ability to identify and locate smaller particles that would have never been found in the past
Keywords :
failure analysis; inspection; integrated circuit testing; integrated circuit yield; maintenance engineering; pattern classification; process monitoring; production testing; surface contamination; FM issue; bare silicon wafer; chamber recoveries; defect density; failure analysis; inspection tool; line size; maintenance; particle size; pattern monitor classification; pattern monitor wafer; pattern monitors; process chamber controls; process chamber recovery; tool recovery; wet strip; Condition monitoring; Failure analysis; Floppy disks; Inspection; Microelectronics; Process control; Rivers; Semiconductor device manufacture; Silicon; Strips;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference, 2001 IEEE/SEMI
Conference_Location :
Munich
Print_ISBN :
0-7803-6555-0
DOI :
10.1109/ASMC.2001.925653
