Explore the impact of improvement that the Polyimide adhesive residue on QFN Package

The main purpose of this research is to confer the tape of polyimide apply to the packaging technology of quad flat no lead (QFN), because QFN is signal side package (one side is compound and one side is metal surface adhesion area). So it can prevent the exceeding glue after molding when this tape is stuck on the metal surface. There are two kinds of materials of lead frame. One is copper and another is PPF (Ni/Pd/Au). For these two kinds of materials, this research will analyze the exceeding glue amount of the tapes and find out the importance of quality characters, and also use variation analysis method to get the best parameter. I found QFN product after molding, which the amount of glue after de-tape will affect the performance of appearance and solderability due to the plasma parameter of front process and post curing conditions. So I want to find out a root cause and effective direction by studying the whole process of packaging manufacturing and hope my research will be useful to QFN packaging technology and other related industry.