Title :
Design methodology for defect tolerant integrated circuits
Author_Institution :
Dept. of Electr. & Comput. Eng., Carnegie-Mellon Univ., Pittsburgh, PA, USA
Abstract :
A single-spot defect which deforms the power of clock connections of a VLSI IC may affect the functionality of an entire die. Typical yield prediction procedures applied to circuits with redundancy do not take this possibility into account. Analysis of the defect´s nature combined with the appropriate modifications of the existing models is used to address this problem. Applications of the yield models to ICs with redundancy indicate that direct power-ground or clock shorts are a very important limitation to the maximal size of such circuits. A novel design approach that uses circuit breakers to minimize consequences of shorts in the metallization of the IC with redundancy is indicated as a necessity for large-area defect-tolerant circuits
Keywords :
VLSI; metallisation; monolithic integrated circuits; redundancy; clock connections; clock shorts; defect tolerant integrated circuits; die; functionality; large-area defect-tolerant circuits; maximal size; metallization; redundancy; single-spot defect; yield prediction procedures; Circuit breakers; Circuit faults; Clocks; Design methodology; Integrated circuit modeling; Metallization; Redundancy; Semiconductor device modeling; Surface contamination; Testing;
Conference_Titel :
Custom Integrated Circuits Conference, 1988., Proceedings of the IEEE 1988
Conference_Location :
Rochester, NY
DOI :
10.1109/CICC.1988.20946