• DocumentCode
    3132591
  • Title

    Growth condition dependence of n-type carriers at the interface between InP substrates and epitaxial layers grown by MOCVD

  • Author

    Nakamura, M. ; Kurita, H. ; Fukui, T.

  • Author_Institution
    Electron. Mater. & Component Labs., Japan Energy Corp., Saitama, Japan
  • fYear
    1995
  • fDate
    9-13 May 1995
  • Firstpage
    140
  • Lastpage
    143
  • Abstract
    We investigated the dependence of n-type carriers at the interface between InP substrates and epitaxial layers grown by MOCVD on the phosphine (PH3) partial pressure and the growth temperature sequence. The carrier concentration decreases with increasing PH3 partial pressure. The carrier concentration also reduces when the temperature during thermal etching is high, and the temperature during the initial growth stage is low. Silicon and oxygen were detected as impurities at the interface by secondary ion mass spectrometry (SIMS) measurement. The silicon concentration is no less than 1×1017 cm-3 under all growth conditions. The oxygen concentration varied from 1×1017 cm-3 to 8×1017 cm-3 and had no relationship with the carrier concentration
  • Keywords
    III-V semiconductors; carrier density; etching; impurity distribution; indium compounds; secondary ion mass spectra; semiconductor epitaxial layers; semiconductor growth; substrates; vapour phase epitaxial growth; InP; InP substrate epitaxial layer interface; InP:O; InP:Si; MOCVD; O impurities; PH3; PH3 partial pressure; Si impurities; carrier concentration; growth temperature sequence; impurity concentration; initial growth stage; interface n-type carriers; secondary ion mass spectrometry; thermal etching; Buffer layers; Epitaxial growth; Epitaxial layers; Etching; Impurities; Indium phosphide; MOCVD; Silicon; Substrates; Temperature dependence;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide and Related Materials, 1995. Conference Proceedings., Seventh International Conference on
  • Conference_Location
    Hokkaido
  • Print_ISBN
    0-7803-2147-2
  • Type

    conf

  • DOI
    10.1109/ICIPRM.1995.522097
  • Filename
    522097