Title :
Session 1: Design, modeling & testing I
Abstract :
Start of the above-titled section of the conference proceedings record.
Keywords :
Analytical models; Assembly systems; Birefringence; Calcium; Coupled mode analysis; Creep; Heat engines; Packaging; Simulated annealing; Testing;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4341-3
DOI :
10.1109/IMPACT.2009.5382294
