Title :
Testing throughput computing interconnect topologies with Tbits/sec bandwidth in manufacturing and in field
Author :
Parulkar, Ishwar ; Huang, Dawei ; Chua, Leandro, Jr. ; Doblar, Drew
Author_Institution :
Scalable Syst. Group, Sun Microsystems, Inc., Santa Clara, CA
Abstract :
The next generation of throughput computing systems designed by Sun Microsystems require interconnect with bandwidth of the order of Tbits/sec. Interconnect topologies for such high bandwidth are based on a few hundred SerDes I/Os on chips operating at multi-Gbps. Testing of these I/Os at only the component level is inadequate. In this paper, we describe the design-for-testability features for system manufacturing and on-line test of such I/Os and interconnect
Keywords :
design for testability; integrated circuit interconnections; integrated circuit manufacture; integrated circuit testing; microprocessor chips; SerDes I-O testing; Sun Microsystems; design-for-testability; interconnect topology testing; on-line test; system interconnect; system manufacturing; throughput computing systems; Bandwidth; Computer aided manufacturing; Microprocessors; Protocols; Pulp manufacturing; Sun; System testing; Throughput; Topology; Yarn;
Conference_Titel :
Test Conference, 2005. Proceedings. ITC 2005. IEEE International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-9038-5
DOI :
10.1109/TEST.2005.1584066
