Title :
Thermal-structural coupled analysis in heating cycle of semiconductor
Author_Institution :
Pitotech, Changhua, Taiwan
Abstract :
A model for RF heated hot wall furnace and a temperature sensor in rapid thermal process is simulated. The mode includes electric induction current, thermal and strain-stress analysis. The model considers a heating cycle and shows temperature variation in wafer, which has reached a stable temperature and then cooled down. And the thermal sensor is compared for inspection the temperature of wafer. Results show the same tendency of temperature variation for the sensor and the wafer, and the sensor radiation has no stable value that should be improved further.
Keywords :
heat radiation; radiofrequency heating; rapid thermal annealing; rapid thermal processing; temperature sensors; thermal management (packaging); thermal stresses; RF heated hot wall furnace; electric induction current; heating cycle; rapid thermal process; strain-stress analysis; temperature sensor; thermal stress analysis; thermal-structural coupled analysis; Heating; RF Heating; Rapid thermal Annealing; Therma; Thermal Radiation;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4341-3
Electronic_ISBN :
978-1-4244-4342-0
DOI :
10.1109/IMPACT.2009.5382297
