• DocumentCode
    3132998
  • Title

    Cluster Ion Implantation - Prospects and Challenges-

  • Author

    Matsuo, Jiro ; Aoki, Takaaki ; Seki, Toshio

  • Author_Institution
    Kyoto Univ., Uji
  • fYear
    2007
  • fDate
    8-9 June 2007
  • Firstpage
    53
  • Lastpage
    54
  • Abstract
    More than ten years have passed since cluster ion implantation was proposed by Kyoto University. Cluster ion implanters equipped with a specially designed ion source are announced for device manufacturing. This technique is now a candidate for ultra shallow junction formation in the ITRS road map. It is essential to understand the atomistic mechanism of cluster implantation, because the behavior of damaged atoms during annealing is a very important topic for high-quality shallow junction formation. The damage induced with cluster ions is presented.
  • Keywords
    annealing; boron; cluster tools; elemental semiconductors; ion implantation; ion sources; semiconductor doping; semiconductor junctions; silicon; Si:B - Interface; annealing; atomistic mechanism; cluster ion implantation; ion source; ultra shallow junction formation; Amorphous materials; Annealing; Atomic beams; Atomic layer deposition; Atomic measurements; Boron; Implants; Ion beams; Ion implantation; Resource description framework;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Junction Technology, 2007 International Workshop on
  • Conference_Location
    Kyoto
  • Print_ISBN
    1-4244-1103-3
  • Electronic_ISBN
    1-4244-1104-1
  • Type

    conf

  • DOI
    10.1109/IWJT.2007.4279945
  • Filename
    4279945