DocumentCode
3132998
Title
Cluster Ion Implantation - Prospects and Challenges-
Author
Matsuo, Jiro ; Aoki, Takaaki ; Seki, Toshio
Author_Institution
Kyoto Univ., Uji
fYear
2007
fDate
8-9 June 2007
Firstpage
53
Lastpage
54
Abstract
More than ten years have passed since cluster ion implantation was proposed by Kyoto University. Cluster ion implanters equipped with a specially designed ion source are announced for device manufacturing. This technique is now a candidate for ultra shallow junction formation in the ITRS road map. It is essential to understand the atomistic mechanism of cluster implantation, because the behavior of damaged atoms during annealing is a very important topic for high-quality shallow junction formation. The damage induced with cluster ions is presented.
Keywords
annealing; boron; cluster tools; elemental semiconductors; ion implantation; ion sources; semiconductor doping; semiconductor junctions; silicon; Si:B - Interface; annealing; atomistic mechanism; cluster ion implantation; ion source; ultra shallow junction formation; Amorphous materials; Annealing; Atomic beams; Atomic layer deposition; Atomic measurements; Boron; Implants; Ion beams; Ion implantation; Resource description framework;
fLanguage
English
Publisher
ieee
Conference_Titel
Junction Technology, 2007 International Workshop on
Conference_Location
Kyoto
Print_ISBN
1-4244-1103-3
Electronic_ISBN
1-4244-1104-1
Type
conf
DOI
10.1109/IWJT.2007.4279945
Filename
4279945
Link To Document