DocumentCode :
3133117
Title :
[Title page]
fYear :
2009
fDate :
21-23 Oct. 2009
Firstpage :
1
Lastpage :
3
Abstract :
Conference proceedings title page.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4341-3
Type :
conf
DOI :
10.1109/IMPACT.2009.5382315
Filename :
5382315
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3133117
