Integration of passive components in thin film multilayer MCM-D technology for wireless front-end applications

Author

Pieters, P. ; Vaesen, K. ; Carchon, G. ; Brebels, S. ; De Raedt, W. ; Beyne, E.

Author_Institution

MCP/HDIP Group, IMEC, Leuven, Belgium

fYear

2000

fDate

2000

Firstpage

221

Lastpage

224

Abstract

In the current trend towards portable applications, the integration of passive components has become very important. This paper introduces high quality integrated passive components in thin film multilayer MCM-D technology. The main characteristics and modeling issues for use at RF and microwave frequencies are discussed. Also, a number of circuits applicable in wireless front-ends using the integrated passives are presented. These show that MCM-D may be used for the integration of miniature systems for wireless applications

Keywords

UHF integrated circuits; microwave integrated circuits; multichip modules; radio equipment; thin film circuits; RF frequencies; high quality integrated passive components; microwave frequencies; miniature systems; modeling; passive components integration; thin film multilayer MCM-D technology; wireless front-end applications; Coplanar waveguides; Copper; Dielectric losses; Dielectric substrates; Dielectric thin films; Integrated circuit interconnections; Integrated circuit technology; Nonhomogeneous media; Thin film circuits; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2000 Asia-Pacific

Conference_Location

Sydney, NSW

Print_ISBN

0-7803-6435-X

Type

conf

DOI

10.1109/APMC.2000.925767

Filename

925767