DocumentCode :
3133348
Title :
MOCVD regrowth of InP:Fe, Zn and Si doped on patterned surface by pulsed metalorganic epitaxy (PME)
Author :
Bertone, D. ; Fornuto, G.
Author_Institution :
CSELT, Torino, Italy
fYear :
1995
fDate :
9-13 May 1995
Firstpage :
279
Lastpage :
282
Abstract :
Buried heterostructure (BH) devices need the regrowth of InP around mesa stripes containing the active region. A crucial point in embedding the heterostructure laser mesas is the edge overgrowth effect, especially when the stripe height is required to be very high (1). Furthermore, a dielectric mask may be present on the semiconductor surface to define the deposition area: e.g. the selective growth of semi-insulating InP around laser mesas for high speed operation devices. After regrowth it is very useful to have a surface as planar as possible for subsequent technological steps and to make good electric contacts. In this work we investigate on the regrowth of InP around mushroom-like cross section stripes, conventional stripes masked with SiNx and tall mesa stripes with dielectric mask on the top by pulsed metalorganic epitaxy (PME)
Keywords :
III-V semiconductors; buried layers; indium compounds; iron; masks; semiconductor growth; semiconductor lasers; silicon; vapour phase epitaxial growth; zinc; InP:Fe,Zn,Si; MOCVD regrowth; PME; SiN; SiNx; active region; buried heterostructure; dielectric mask; edge overgrowth effect; electric contacts; heterostructure laser mesas; high speed operation devices; mesa stripes; mushroom-like cross section stripes; patterned surface; pulsed metalorganic epitaxy; selective growth; semi-insulating InP; semiconductor surface; stripe height; tall mesa stripes; Epitaxial growth; Etching; Indium phosphide; Inductors; MOCVD; Pulsed laser deposition; Semiconductor lasers; Silicon compounds; Switches; Zinc;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Indium Phosphide and Related Materials, 1995. Conference Proceedings., Seventh International Conference on
Conference_Location :
Hokkaido
Print_ISBN :
0-7803-2147-2
Type :
conf
DOI :
10.1109/ICIPRM.1995.522134
Filename :
522134
Link To Document :
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